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Title
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Single-Exposure Volumetric Photolithography for Ultra-High-Aspect-Ratio Microstructures: Demonstration with a “UTAH” Pattern
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Description
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We present a single-exposure volumetric nanofabrication strategy capable of producing 3D structures with aspect ratios exceeding 100:1 and a theoretical minimum feature size of 4 µm. An inverse-designed holographic phase mask reconstructs a prescribed ultra–depth-of-field ultraviolet intensity distribution within SU-8 photoresist, delivering the required polymerization dose throughout the target volume in a single step.
As a demonstration, the four letters “UTAH” were fabricated using four sequential exposures in the Rajesh Group, Department of Electrical Engineering, with an exposure time of approximately 20 s per exposure. This approach enables the fabrication of a wide range of architectures spanning volumes up to 2400 × 800 × 720 µm³, corresponding to effective voxel rates on the order of 0.36 × 10⁶ voxels s⁻¹. The fabricated structure was coated with Pt and imaged using a scanning electron microscope (SEM, FEI Quanta 600 FEG) in Utah NanoFab.
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Date
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2026-01-19
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Creator
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Lin, Dajun
